Program and Presentations

Sunday, May 1st, 2016

From 20:00 Reception
Monday, May 2nd, 2016
9:00 - 9:10     Opening
9:10 - 10:40     Session I:  Understanding of screenprinted contacts
Ankit Khanna SERIS - NUS Advanced characterisation of recombination at metal contacts in silicon wafer solar cells
Daniel Inns DuPont Understanding recombination losses from screen printed silver
Pietro Altermatt Trina Solar Shape and homhogeneity of front metal fingers - impact on cell efficiency and its distribution in production line
Hee-Soo Kim Korea University Electrochemical nature of contact firing reactions for front-side Ag metallization of crystalline Si solar cells
10:40 - 11:10     Coffee break
11:10 - 12:40     Session II: Advanced printing
Helge Hannebauer ISFH Hameln Single print metal stencils for high-efficiency silicon solar cells
Andreas Lorenz Fraunhofer ISE Rotational printing technology for the metallization of highly efficient busbarless solar cells
Marco Galiazzo Applied Materials Italia Fine line double printing for today and tomorrow cell metallization and module interconnection
Maximilian Pospischil Fraunhofer ISE High speed dispensing with novel 6'' print head
12:40 - 13:50     Lunch break
13:50 - 15:20     Session III: Ni/Cu plated contacts
Ning Song UNSW Post-plating annealing of light -induced plated copper fingers: implications for reliable metallisation
John Burschik Rena Technologies  Transition to 4 and 5 BB designs for Ni/Cu/Ag plated cells
Kuang-Chieh Lai Motech Industries Cu-plated electrodes with green nano-laser opening metal contact on n-type silicon solar cells
Sukhvinder Singh imec Investigation of radiation damage of Cu plated IBC cells caused by sputtering of seed layer
15:20 - 15:50     Coffee break
15:50 - 17:00     Session IV:  Durability of metallization and interconnection
Sven Kluska  Fraunhofer ISE Long term stability evaluation of copper containing contacts on cell and module level
Ines Duerr Fraunhofer ISE Silver grid finger corrosion on snail track affected PV modules - investigation on degradation products and mechanisms
Torsten Geipel Fraunhofer ISE A comprehensive study of intermetallic compounds in solar cell interconnections and their growth kinetics
17:00 - 18:30     Session V: Poster Session and Market Place Discussion
Shu-Yen Liu Motech Industries Electrical properties of forward bias plated Ni-Cu contacts on n-type PERT solar cells
Yueh-Lin Lee Motech Industries Forward bias plated nickel-copper-tin contacts for crystalline silicon solar cells
Tobias Messmer ISC Konstanz Low Cost Semi Automated assembly unit for small size back contact modules and low cost intercennection approach
Jonas Buddgård JB EcoTech Accelerated lifetime tests of solution for production of photovoltaic solar cells and modules at reduced costs
Gregory Berube Heraeus Designing organic system to improve finger line shape and smoothness for high performance front side metallizations
From 18:45 Aperitif & Dinner
Tuesday, May 3rd, 2016
9:00 - 10:30     Session VI: New metallization for advanced solar cells
Sebastian Mack Fraunhofer ISE Impact of firing temperature profiles on local BSF formation in PERC solar cells
Markus Eberstein Fraunhofer IKTS High performance silver polymer pastes for HJT cells
Ming Shiou Lin Motech Investigation of metal contacts via thermal treatment at interfaces between low temperature Ag pastes and TCO layer for HIT solar cell
Stefan Körner Fraunhofer IKTS Transparent front side contact pastes for high efficiency HJT-solar cells
10:30 - 11:00     Coffee break
11:00 - 12:30     Session VII:   Screenprinted contacts on p+ surfaces
Josh Engelhardt University of Konstanz Contact formation with Al - free Ag pastes on p+ layers
Eric Kossen ECN Contacting high ohmic boron emitters with screen print paste on n-Pasha
Takayuki Aoyama Noritake  Effect of aluminum in metallization paste on the electrical losses in bifacial n-type crystalline silicon solar cells
12:30 - 13:30     Lunch break
13:30 - 15:00     Session VIII: Alternative interconnections
Stefan Dauwe Halm Precise IV-measurement of busbarless solar cells including process control methods for production
Antonin Faes CSEM PV-Center Advanced metallization enabled by multi-wire interconnection for silicon heterojunction cells and modules
Guy Beaucarne Dow Corning Materials challenge for shingled cells interconnection
Torsten Geipel Fraunhofer ISE Low-temperature interconnection of PVD-aluminium metallization
15:00 - 15:30     Closing
15:30 - 16:00     Coffee and Goodbye
Imprint Sitemap



media partner