Sunday, May 1st, 2016 | | |
| From 20:00 | | | Reception |
| Monday, May 2nd, 2016 |
| 9:00 - 9:10 | | | Opening |
| | | |
| 9:10 - 10:40 | | | Session I: Understanding of screenprinted contacts
|
| Ankit Khanna | SERIS - NUS | Advanced characterisation of recombination at metal contacts in silicon wafer solar cells |
| Daniel Inns | DuPont | Understanding recombination losses from screen printed silver |
| Pietro Altermatt | Trina Solar | Shape and homhogeneity of front metal fingers - impact on cell efficiency and its distribution in production line |
| Hee-Soo Kim | Korea University | Electrochemical nature of contact firing reactions for front-side Ag metallization of crystalline Si solar cells |
| 10:40 - 11:10 | | | Coffee break |
| 11:10 - 12:40 | | | Session II: Advanced printing
|
| Helge Hannebauer | ISFH Hameln | Single print metal stencils for high-efficiency silicon solar cells |
| Andreas Lorenz | Fraunhofer ISE | Rotational printing technology for the metallization of highly efficient busbarless solar cells |
| Marco Galiazzo | Applied Materials Italia | Fine line double printing for today and tomorrow cell metallization and module interconnection |
| Maximilian Pospischil | Fraunhofer ISE | High speed dispensing with novel 6'' print head |
| 12:40 - 13:50 | | | Lunch break |
| 13:50 - 15:20 | | | Session III: Ni/Cu plated contacts
|
| Ning Song | UNSW | Post-plating annealing of light -induced plated copper fingers: implications for reliable metallisation |
| John Burschik | Rena Technologies | Transition to 4 and 5 BB designs for Ni/Cu/Ag plated cells |
| Kuang-Chieh Lai | Motech Industries | Cu-plated electrodes with green nano-laser opening metal contact on n-type silicon solar cells |
| Sukhvinder Singh | imec | Investigation of radiation damage of Cu plated IBC cells caused by sputtering of seed layer |
| 15:20 - 15:50 | | | Coffee break |
| 15:50 - 17:00 | | | Session IV: Durability of metallization and interconnection
|
| Sven Kluska | Fraunhofer ISE | Long term stability evaluation of copper containing contacts on cell and module level |
| Ines Duerr | Fraunhofer ISE | Silver grid finger corrosion on snail track affected PV modules - investigation on degradation products and mechanisms |
| Torsten Geipel | Fraunhofer ISE | A comprehensive study of intermetallic compounds in solar cell interconnections and their growth kinetics |
| 17:00 - 18:30 | | | Session V: Poster Session and Market Place Discussion |
| Shu-Yen Liu | Motech Industries | Electrical properties of forward bias plated Ni-Cu contacts on n-type PERT solar cells |
| Yueh-Lin Lee | Motech Industries | Forward bias plated nickel-copper-tin contacts for crystalline silicon solar cells |
| Tobias Messmer | ISC Konstanz | Low Cost Semi Automated assembly unit for small size back contact modules and low cost intercennection approach |
| Jonas Buddgård | JB EcoTech | Accelerated lifetime tests of solution for production of photovoltaic solar cells and modules at reduced costs |
| Gregory Berube | Heraeus | Designing organic system to improve finger line shape and smoothness for high performance front side metallizations |
| | | |
| From 18:45 | | | Aperitif & Dinner |
| | | |
| Tuesday, May 3rd, 2016 |
| 9:00 - 10:30 | | | Session VI: New metallization for advanced solar cells
|
| Sebastian Mack | Fraunhofer ISE | Impact of firing temperature profiles on local BSF formation in PERC solar cells |
| Markus Eberstein | Fraunhofer IKTS | High performance silver polymer pastes for HJT cells |
| Ming Shiou Lin | Motech | Investigation of metal contacts via thermal treatment at interfaces between low temperature Ag pastes and TCO layer for HIT solar cell |
| Stefan Körner | Fraunhofer IKTS | Transparent front side contact pastes for high efficiency HJT-solar cells |
| 10:30 - 11:00 | | | Coffee break |
| 11:00 - 12:30 | | | Session VII: Screenprinted contacts on p+ surfaces
|
| Josh Engelhardt | University of Konstanz | Contact formation with Al - free Ag pastes on p+ layers |
| Eric Kossen | ECN | Contacting high ohmic boron emitters with screen print paste on n-Pasha |
| Takayuki Aoyama | Noritake | Effect of aluminum in metallization paste on the electrical losses in bifacial n-type crystalline silicon solar cells |
| 12:30 - 13:30 | | | Lunch break |
| 13:30 - 15:00 | | | Session VIII: Alternative interconnections
|
| Stefan Dauwe | Halm | Precise IV-measurement of busbarless solar cells including process control methods for production |
| Antonin Faes | CSEM PV-Center | Advanced metallization enabled by multi-wire interconnection for silicon heterojunction cells and modules |
| Guy Beaucarne | Dow Corning | Materials challenge for shingled cells interconnection |
| Torsten Geipel | Fraunhofer ISE | Low-temperature interconnection of PVD-aluminium metallization |
| 15:00 - 15:30 | | | Closing |
| 15:30 - 16:00 | | | Coffee and Goodbye |
