| Monday, October 20th, 2014 |
| 9:00 - 9:10 | | | Opening |
| | | |
| 9:10 - 10:40 | | | Session I: Formation of screenprinted contacts
Jooyoul Huh, Gunnar Schubert |
| René Hönig | Fraunhofer ISE | Comprehensive study on the macroscopic and microscopic electrical behavior of screen printed silver contacts to phosphorus-doped emitters |
| Oliver Eibl | Universität Tübingen | Combined microstructural and electrical characterization of metallization layers in industrial solar cells |
| Sung-Bin Cho | Korea University | Effect of forming gas annealing on screen-printed Ag metallization of silicon solar cells |
| Oliver Eibl | Universität Tübingen | Serial and contact resistance measurements between 80 K and room temperature for industrial solar cells |
| 10:40 - 11:10 | | | Coffee break |
| 11:10 - 12:40 | | | Session II: Optimisation of screenprinted contacts
Marco Galliazo, Giso Hahn |
| Tetsu Takahashi | Namics Corporation | New Metallization Concept for High Efficiency/Low Cost c-Si Photovoltaic Solar Cells |
| Bob Wind | ECN | New method to optimize metallization schemes for n-Pasha cells |
| Helge Hannebauer | ISFH | Optimized stencil print for low Ag paste consumption and high conversion efficiencies |
| Stefan Körner | IKTS | Basic study on the influence of glass composition and aluminum content on the Ag/Al paste contact formation to boron emitters |
| 12:40 - 13:50 | | | Lunch break |
| 13:50 - 15:20 | | | Session III: Ni/Cu plated contacts I
Jonas Bartsch, Jörg Horzel |
| Richard Russell | IMEC | The Potential for Cu-free Ni Plated Contacts Enabled by Smart Wire Connection Technology |
| Jonas Geissbühler | STI PVLAB - EPFL Neuchâtel | Electrodeposited copper front metallization for silicon heterojunction solar cells: materials and processes |
| Agata Lachowicz | CSEM | Plating on Thin Conductive Oxides for Silicon Heterojunction Solar Cells |
| Zhongtian Li | UNSW | Patterning for Plated Heterojunction Cells |
| 15:20 - 15:50 | | | Coffee break |
| 15:50 - 17:20 | | | Session IV: Contacts to p-type silicon
Thomas Buck, Stefanie Riegel |
| Susanne Fritz | Universität Konstanz | Preservation of Si surface structure by AgAl contact spots – an explanatory model |
| Katharina Dressler | Universität Konstanz | Void Characterization with Scanning Acoustic Microscopy and Computer Tomography |
| Christopher Kranz | ISFH | Determination of the contact resistivity of screen-printed Al contacts formed by laser contact opening |
| Mathias Kamp | Fraunhofer ISE | Electrochemical Contact Separation for PVD Aluminum Back Contact Solar Cells |
| 17:20 - 18:30 | | | Session V: Market Place Discussion |
| Antonin Faes | CSEM | SmartWire Solar Cell Interconnection Technology |
| Guy Beaucarne | Dow Corning | Ribbon bonding on busbar-less cells using Electrically Conductive Adhesives: Potential and challenges |
| Gisela Cimiotti | Fraunhofer ISE | Design rules for solar cells with plated metallization |
| Ran Chen | UNSW | Failure Modes Identified During Adhesion Testing of Metal Fingers on Silicon Solar Cells |
| Markus König | Heraeus Precious Metals | Screen Printing Ag Metallization Technology meet the challenges of today’s c-Si Solar Cell |
| Marco Galiazzo | Applied Materials Italia | Fine Line Double Printing and Advanced Process Control for Cell Manufacturing |
| | | |
| From 18:45 | | | Aperitiv & Dinner: "Il Boccone", Bodanstraße 20-22, 78462 Konstanz |
| | | |
| Tuesday, October 21st, 2014 |
| 9:00 - 10:30 | | | Session VI: From Cells to Modules
Armand Bettinelli, Valentin Mihailetchi |
| Kees Broek | ECN | MWT cells merit a sound contact to the conductive back sheet |
| Pierre Papet | Roth & Rau Research AG | Silver usage reduction for monofacial and bifacial heterojunction solar cells |
| Ines Dürr | Fraunhofer ISE | Metallization Material Qualification in terms of Damp Heat Induced Degradation (DHID) |
| Evert Bende | ECN | The effect of reduced silver paste consumption on the cost per Wp for MWT-cell modules and H-pattern cell modules. |
| 10:30 - 11:00 | | | Coffee break |
| 11:00 - 12:30 | | | Session VII: Metallization Technology
Aba Ebong, Ralf Preu |
| Andreas Lorenz | Fraunhofer ISE | High Throughput Flexographic Printing for Front Side Metallization of Busbar-less Solar Cells |
| Maximilian Pospischil | Fraunhofer ISE | Dispensing Technology on the Route to an Industrial Metallization Process |
| Michael Zenou | Orbotech | Solar cell metallization by laser transfer of metal micro-droplets |
| Jan Lossen | ISC / Utilight | Pattern Transfer Printing (PTPâ„¢) for c-Si PV solar cell metallization |
| 12:30 - 13:30 | | | Lunch break |
| 13:30 - 15:00 | | | Session VIII: Ni/Cu plated contacts II
Pietro Altermatt, Richard Russell |
| Jörg Horzel | Rena | Shifting the limits with Cu based Metallisation and Advanced Plating technology |
| Achim Kraft | Fraunhofer ISE | Characterization of copper diffusion in silicon solar cells |
| Shruti Jambaldinni | Fraunhofer ISE | Investigation of Salicide Process from Sputtered Nickel on Structured SiNx ARC Layers for Mono-crystalline Si Solar Cells |
| Guy Beaucarne | Dow Corning | Non-contacting busbars for advanced cell structures using low temperature Cu paste |
| 15:00 - 15:30 | | | Closing |
| 15:30 - 16:00 | | | Coffee and Goodbye |
